ASCEND
BY NTHRYS

NTHRYS › PhD Assistance › Microelectronics Engineering

Microelectronics Engineering

Field
▾
Category
▾

Microelectronics Engineering

Select a category to explore research frontiers

Loading categories...

Research Frontiers in 3D Integrated Circuit Design

Vertical stacking of multiple silicon dies with through-silicon vias for improved performance and reduced footprint.

Thermal Management in Vertically Stacked Chiplets
Monolithic 3D Integration Beyond Silicon Limits
Interconnect Density and Signal Integrity Trade-offs
Heterogeneous Integration of Dissimilar Materials
Power Delivery Networks in Three-Dimensional Architectures
Yield and Defect Propagation in 3D Bonding
Electromagnetic Coupling in Dense Vertical Interconnects
Die-to-Die Communication Protocols and Latency
Thermal-Aware Placement Algorithms for 3D Circuits
Reliability of Through-Silicon Vias Under Stress

All Microelectronics Engineering PhD categories